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Micro processing innovation

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Micro processing innovation
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Micro processing innovation

Applying extra-high laser output and
micro processing innovation to large-area processing
HOYA laser repair systems enable processing of a wide range of products, including semiconductors in the 0.5 300m range and metallic thin films for flat panel displays. They can even be used for large-area processing of color filters. Their repeat frequency can be as high as 50Hz, so they can readily handle various applications.
Processing adaptability by wavelength
Wavelength 1064nm (IR) 532nm (Green) 355nm (UV) 266nm (DUV)
Metal Chromium (Cr)
Aluminum (Al)
ITO
  Copper (Cu)  
  Gold (Au)  
    Molybdenum (Mo)
  Titanium (Ti)  
Nickel (Ni)  
  Nickel chromium  
  Titanium-tungsten  
Semiconductor material - Silicon nitride
- Polymide
TFT Welding or wiring -
Color filter RGB
  Defect in color filter  
Over-coating of color filter
Semiconductors / FPD Polysilicon -
Processing examples
TFT panel Before cutting
TFT panel Before cutting
TFT panel After cutting
TFT panel After cutting
 
TFT panel Before cutting
TFT panel Before cutting
TFT panel After cutting
TFT panel After cutting
 
PC board Before cutting
PC board Before cutting
PC board After cutting
PC board After cutting
 
O-LED
O-LED
Expose bottom layer of IC
Expose bottom layer of IC
 
Exfoliation of protection layer for IC
Expose bottom layer of IC
Color filter processing
Color filter processing
 
Cr film processing
Cr film processing
Point markings of analysis
Point markings of analysis